Chip-ka dib-u-habaynta ee ay samaysay RUNAU Electronics waxa markii hore soo bandhigay GE habaynta iyo tignoolajiyada u hoggaansan heerka codsiga Maraykanka oo ay u qalmaan macaamiisha adduunka oo dhan.Waxaa lagu soo bandhigay sifooyinka caabbinta daalka kulaylka xooggan, nolosha adeegga dheer, danab sare, hadda weyn, la qabsiga deegaanka oo xooggan, iwm.Xulashada joogtada ah ee cabbirada chips ayaa diyaar ah si loo bixiyo iyadoo loo eegayo shuruudaha codsiga.
Halbeegga:
Dhexroorka mm | Dhumucda mm | Voltage V | Cathode Out Dia. mm | Tjm ℃ |
17 | 1.5±0.1 | ≤2600 | 12.5 | 150 |
23.3 | 1.95±0.1 | ≤2600 | 18.5 | 150 |
23.3 | 2.15±0.1 | 4200-5500 | 16.5 | 150 |
24 | 1.5±0.1 | ≤2600 | 18.5 | 150 |
25.4 | 1.4-1.7 | ≤3500 | 19.5 | 150 |
29.72 | 1.95±0.1 | ≤2600 | 25 | 150 |
29.72 | 1.9-2.3 | 2800-5500 | 23 | 150 |
32 | 1.9±0.1 | ≤2200 | 27.5 | 150 |
32 | 2±0.1 | 2400-2600 | 26.3 | 150 |
35 | 1.8-2.1 | ≤3500 | 29 | 150 |
35 | 2.2±0.1 | 3600-5000 | 27.5 | 150 |
36 | 2.1±0.1 | ≤2200 | 31 | 150 |
38.1 | 1.9±0.1 | ≤2200 | 34 | 150 |
40 | 1.9-2.2 | ≤3500 | 33.5 | 150 |
40 | 2.2-2.5 | 3600-6500 | 31.5 | 150 |
45 | 2.3±0.1 | ≤3000 | 39.5 | 150 |
45 | 2.5±0.1 | 3600-4500 | 37.5 | 150 |
50.8 | 2.4-2.7 | ≤4000 | 43.5 | 150 |
50.8 | 2.8±0.1 | 4200-5000 | 41.5 | 150 |
55 | 2.4-2.8 | ≤4500 | 47.7 | 150 |
55 | 2.8-3.1 | 5200-6500 | 44.5 | 150 |
63.5 | 2.6-3.0 | ≤4500 | 56.5 | 150 |
63.5 | 3.0-3.3 | 5200-6500 | 54.5 | 150 |
70 | 2.9-3.1 | ≤3200 | 63.5 | 150 |
70 | 3.2±0.1 | 3400-4500 | 62 | 150 |
76 | 3.4-3.8 | ≤4500 | 68.1 | 150 |
89 | 3.9-4.3 | ≤4500 | 80 | 150 |
99 | 4.4-4.8 | ≤4500 | 89.7 | 150 |
Tilmaamaha farsamada:
RUNAU Electronics waxay siisaa chips koronto semiconductor ah diode hagaajinta iyo diode alxanka.
1. Hoos u dhaca danab ee gobolka
2. Bir-samaynta dahabka ayaa lagu dabaqi doonaa si loo hagaajiyo hanti-wadareedka iyo kulaylka.
3. mesa ilaalinta lakabka double
Talooyin:
1. Si loo sii ahaado waxqabadka wanaagsan, chip waa in lagu kaydiyaa nitrogen ama xaalad faaruq ah si looga hortago isbeddelka korantada ee ay keento oksaydhka iyo huurka qaybaha molybdenum
2. Had iyo jeer nadiifi dusha sare ee jajabka, fadlan xidho galoofyada oo ha ku taaban jajabka gacmo qaawan
3. Si taxadar leh ugu shaqee habka isticmaalka.Ha dhaawicin cidhifka resin ee chip-ka iyo lakabka aluminium ee aagga tiirka albaabka iyo cathode
4. Imtixaanka ama koobidda, fadlan ogow in isbarbardhigga, fidsanaanta iyo xoogga isku dhejinta ay tahay in qalabku uu la mid noqdo heerarka la cayimay.Isbarbar yaac liita waxay keeni doontaa cadaadis aan sinnayn iyo dhaawac xoog leh.Haddii xoog-qabsiga xad-dhaafka ah lagu soo rogo, jajabku si fudud ayuu u dhaawacmi doonaa.Haddii xoogga xajin ee la soo rogay uu aad u yar yahay, xiriirka liita iyo kulaylka ayaa saameyn doona codsiga.
5. Xakamaynta cadaadiska ee taabashada dusha sare ee cathode ee chip waa in la tirtiraa
Ku tali Ciidanka Isku-xidhka
Cabbirka Chips | Talada Ciidanka Isku-xidhka |
(KN) 10% | |
Φ25.4 | 4 |
Φ30 ama Φ30.48 | 10 |
Φ35 | 13 |
Φ38 ama Φ40 | 15 |
Φ50.8 | 24 |
Φ55 | 26 |
Φ60 | 28 |
Φ63.5 | 30 |
Φ70 | 32 |
Φ76 | 35 |
Φ85 | 45 |
Φ99 | 65 |